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1

Challenges of back end of the line for sub 65 nm generation

M. Fayolle, G. Passemard, O. Louveau, F. Fusalba, J. Cluzel

Journal:

Microelectronic Engineering

Year:

2003

Language:

english

File:

PDF, 1.59 MB

english, 2003

2

The Interest of Diazonium Chemistry for Aqueous Lithium-Ion Battery

Alloin, F., Crepel, L., Cointeaux, L., Lepretre, J.- C., Fusalba, F., Martinet, S.

Journal:

Journal of The Electrochemical Society

Year:

2013

Language:

english

File:

PDF, 956 KB

english, 2013

3

Student-perceived organizational support and perceived employability in the marketing of higher education

Trullas, Irene, Simo, Pep, Fusalba, Oriol R., Fito, Angels, Sallan, Jose M.

Journal:

Journal of Marketing for HIGHER EDUCATION

Year:

2018

Language:

english

File:

PDF, 1.78 MB

english, 2018

4

[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Porous low k pore sealing process study for 65 nm and below technologies

Mourier, T., Jousseaume, V., Fusalba, F., Lecornec, C., Maury, P., Passemard, G., Haumesser, P.H., Maitrejean, S., Cordeau, M., Pantel, R., Pierre, F., Fayolle, M., Feldis, H.

Year:

2003

Language:

english

File:

PDF, 237 KB

english, 2003

5

[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Adhesion studies of thin films on ultra low k

Maitrejean, S., Fusalba, F., Patz, M., Jousseaume, V., Mourier, T.

Year:

2002

Language:

english

File:

PDF, 218 KB

english, 2002

6

[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Cu/ULK integration using a post integration porogen removal approach

Fayolle, M., Jousseaume, V., Assous, M., Tabouret, E., le Cornec, C., Haumesser, P.H., Leduc, P., Feldis, H., Louveau, O., Passemard, G., Fusalba, F.

Year:

2004

Language:

english

File:

PDF, 239 KB

english, 2004

7

Safe Li-Ion Technology for Micro and Mild Hybrid application based on CEA Bipolar LiFePO4/Li4Ti5O12 technology

Chami, M., Mailley, S., Reynier, Y., Masse, F., Martinet, S., Fusalba, F.

Journal:

World Electric Vehicle Journal

Year:

2009

Language:

english

File:

PDF, 1.36 MB

english, 2009

8

Porous extreme low κ (ELκ) dielectrics using a PECVD porogen approach

L. Favennec, V. Jousseaume, V. Rouessac, F. Fusalba, J. Durand, G. Passemard

Journal:

Materials Science in Semiconductor Processing

Year:

2004

Language:

english

File:

PDF, 291 KB

english, 2004

9

Electrochemical characterization of polyaniline–molybdenum trisulfide electrode in non-aqueous media

Florence Fusalba, Daniel Bélanger

Journal:

Electrochimica Acta

Year:

2000

Language:

english

File:

PDF, 142 KB

english, 2000

10

Integration of Cu/SiOC in Cu dual damascene interconnect for 0.1-μm technology

M Fayolle, J Torres, G Passemard, F Fusalba, G Fanget, D Louis, M Assous, O Louveau, M Rivoire, K Haxaire, M Mourier, S Maitrejean, P Besson, L Broussous, L Arnaud, H Feldis

Journal:

Microelectronic Engineering

Year:

2002

Language:

english

File:

PDF, 1.51 MB

english, 2002

11

Porosimetry Measurements on Low Dielectric Constant—Thin Layers by Coupling Spectroscopic Ellipsometry and Solvent Adsorption-Desorption

Patrick Revol, Damien Perret, François Bertin, Florence Fusalba, Vincent Rouessac, Amal Chabli, Gérard Passemard, André Ayral

Journal:

Journal of Porous Materials

Year:

2005

Language:

english

File:

PDF, 1.10 MB

english, 2005

12

Influence of the presence of a gel in the water phase on the electrochemical transfer of ionic forms of β-blockers across a large water∣1,2-dichloroethane interface

Sebastien Fantini, Jason Clohessy, Karine Gorgy, Florence Fusalba, Christoffer Johans, Kyösti Kontturi, Vincent J. Cunnane

Journal:

European Journal of Pharmaceutical Sciences

Year:

2003

Language:

english

File:

PDF, 431 KB

english, 2003

13

Physicochemical and Electrochemical Characterization of Polycyclopenta[2,1-b;3,4-b‘]dithiophen-4-one as an Active Electrode for Electrochemical Supercapacitors

Fusalba, Florence, El Mehdi, Naima, Breau, Livain, Bélanger, Daniel

Journal:

Chemistry of Materials

Year:

1999

Language:

english

File:

PDF, 416 KB

english, 1999

14

Electropolymerization of 2,2′:5′,2″ terthiophene at an electrified liquid–liquid interface

Karine Gorgy, Florence Fusalba, Una Evans, Kyosti Kontturi, Vincent J Cunnane

Journal:

Synthetic Metals

Year:

2001

Language:

english

File:

PDF, 190 KB

english, 2001

15

Electrochemical Characterization of Polyaniline in Nonaqueous Electrolyte and Its Evaluation as Electrode Material for Electrochemical Supercapacitors

Fusalba, Florence, Gouérec, Pascal, Villers, Dominique, Bélanger, Daniel

Journal:

Journal of The Electrochemical Society

Year:

2001

Language:

english

File:

PDF, 325 KB

english, 2001

16

Electropolymerization of Polypyrrole and Polyaniline−Polypyrrole from Organic Acidic Medium

Fusalba, Florence, Bélanger, Daniel

Journal:

Journal of Physical Chemistry B

Year:

1999

Language:

english

File:

PDF, 299 KB

english, 1999

17

Poly(Cyano-Substituted Diheteroareneethylene) as Active Electrode Material for Electrochemical Supercapacitors

Fusalba, Florence, Ho, Hoang Anh, Breau, Livain, Bélanger, Daniel

Journal:

Chemistry of Materials

Year:

2000

Language:

english

File:

PDF, 224 KB

english, 2000

18

Análisis de las indicaciones y diagnósticos de las gastroscopias solicitadas por médicos de atención primaria

Vernet Vernet, M., Roca Figueras, G., Jovell Fernández, E., Iglesias Rodríguez, M., Ureña Tapia, M.M., Roca Fusalba, A.

Journal:

Atención Primaria

Year:

2000

File:

PDF, 76 KB

2000

19

[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Intrachip optical interconnect: an above IC approach

Jeannot, S., Schnell, N., Orobtchouk, R., Fedeli, J.M., Fusalba, F., Jousseaume, V., Maury, P., Gaillard, F., Benyattou, T., Passemard, G.

Year:

2004

Language:

english

File:

PDF, 254 KB

english, 2004

20

[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - General review of issues and perspectives for advanced copper interconnections using air gap as ultra-low K material

Gosset, L.G., Arnal, V., Prindle, C., Hoofman, R., Verheijden, G., Daamen, R., Broussous, L., Fusalba, F., Assous, M., Chatterjee, R., Torres, J., Gravesteijn, D., Yu, K.C.

Year:

2003

Language:

english

File:

PDF, 291 KB

english, 2003

21

Electrochemical characterization in nonaqueous electrolyte of polyaniline electrochemically prepared from aqueous media

Garcia, Béatrice, Fusalba, Florence, Bélanger, Daniel

Journal:

Canadian Journal of Chemistry

Year:

1997

File:

PDF, 118 KB

1997

22

What is the predictive value of urinary symptoms for diagnosing urinary tract infection in women?

Medina-Bombardo, D, Segui-Diaz, M, Roca-Fusalba, C, Llobera, J

Journal:

Family Practice

Year:

2003

Language:

english

File:

PDF, 63 KB

english, 2003

23

Chemical synthesis and characterization of polyaniline-molybdenum trisulfide composite

Fusalba, Florence, Bélanger, Daniel

Journal:

Journal of Materials Research

Year:

1999

Language:

english

File:

PDF, 306 KB

english, 1999

24

Rechargeable Lithium-Ion Batteries for Wireless Smart Designs and Extreme Conditions

Rouault, H., Mourzagh, D., Daniel, L., Moreau, G., Fusalba, F.

Journal:

ECS Transactions

Year:

2013

Language:

english

File:

PDF, 582 KB

english, 2013

25

[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Integration of Cu/SiOC in dual damascene interconnect for 0.1 μm technology using a new SiC material as dielectric barrier

Fayolle, M., Torres, J., Passemard, G., Fusalba, F., Fanget, G., Louis, D., Arnaud, L., Girault, V., Cluzel, J., Feldis, H., Rivoire, M., Louveau, O., Mourier, T., Broussous, L.

Year:

2002

Language:

english

File:

PDF, 275 KB

english, 2002

26

Enhanced Power Sources Compatible With Extended Thermal Environment

Reynier, Yvan, Fusalba, Florence, Labbé, Julien, Gineste, Valery, Bürgler, Brandon, Fernandez, A.

Journal:

E3S Web of Conferences

Year:

2017

Language:

english

File:

PDF, 916 KB

english, 2017

27

High Specific Li-ion cells based on high voltage materials

Ligneel, E., Defer, M., Fischer, F., Dumont, E., Fusalba, F., Chami, M., Gineste, V., Nestoridi, M., Fernandez, A.

Journal:

E3S Web of Conferences

Year:

2017

Language:

english

File:

PDF, 870 KB

english, 2017

28

[IEEE 2019 European Space Power Conference (ESPC) - Juan-les-Pins, France (2019.9.30-2019.10.4)] 2019 European Space Power Conference (ESPC) - Batteries for Satellites Constellation, using Lean Manufacturing for Space Industry

Perino-Gallice, Laurence, Masson, Olivier, Bel, Michel, Fusalba, Florence

Year:

2019

File:

PDF, 916 KB

2019

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